Mechanical Engineering Intern M/F

Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems. The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈‍⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously!   We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together! Responsibilities: • • Characterize the current readout chain and define the specification • Map the existing chain: assembly time, defect rate, insertion losses, footprint • Define the specification with the operation and RF teams: number of lines (target 32), MXC envelope, insertion loss budget, thermalization requirements • Study and select the mechanical architecture • Compare two architectures: a pre-cabled block with non-threaded connections, and a block with a single plug interface to the MXC • Benchmark compact components available on the market • Build a decision matrix and defend the chosen architecture in design review • Design the readout module • Produce the CAD model, drawings and a costed bill of materials (BOM) • Select materials and design thermalization to the MXC plate • Define torque specifications and perform the SMP tolerance stack-up • Choose connectors compatible with a future board-edge/PCB integration • Write an assembly and inspection procedure that a subcontractor can follow • Build and validate a prototype in the cryostat • Assemble the prototype and measure the real assembly time • Perform SOLT/SOLR calibration and S-parameter characterization at room temperature and cold • Compare performance against the SMA reference chain and write a measurement report • Recommend the path to industrialization • Deliver a go/no-go recommendation based on measurement results • Build an industrialization roadmap, including inputs for the phase-2 PCB study Requirements: Final-year Master's or engineering student in mechanical engineering or mechatronics , with an interest in RF and cryogenic hardware. Hands-on and rigorous, you enjoys building, testing and documenting hardware and is comfortable presenting technical choices to multidisciplinary teams. • Mechanical design for assembly (DFA) and tolerance analysis (stack-ups) • Proficiency in CAD (SolidWorks) and technical drawing • Material selection and thermal design, ideally with an interest in cryogenic constraints • Basic knowledge of RF connectors and coaxial lines (a plus) • Interest in RF measurements (VNA, S-parameters) and cryogenics • Hands-on approach: comfortable assembling and testing hardware • Rigor and clear technical documentation • Ability to structure and present technical choices in a design review • LANGUAGES: Proficient in English • EXPERIENCE: No minimum required. A previous internship or project in mechanical design, prototyping or testing is a plus. Availability: 6 months.