Package Roadmap Tool Intern – Package Innovation
NXP Semiconductors Kuala Lumpur
The full posting
Published by NXP Semiconductors. Original posting (opens in a new tab)
Package Roadmap Tool Intern – Package Innovation
Role Summary
Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.
Key Responsibilities
• Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment
• Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework
• Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations)
• Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness
• Collaborate cross-functionally with platform, API, and manufacturing teams
Additional Exposure
• Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows
Qualifications
• Degree candidate in Computer Science (preferred), Engineering, or related field
• Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks)
• Experience with Excel, Power BI, or similar tools for visualization and tool development
• Ability to translate technical inputs into structured, scalable frameworks
• Self-driven with strong collaboration and communication skills
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