Hardware internships for Summer 2027
1,303 open postings from 272 employers. WSP (94), Stantec (88) and RTX (73) have posted the most. The most are in San Francisco, CA (42), Los Angeles, CA (34) and Austin, TX (29). The fields their titles name most are engineering (1,105), hardware engineering (168) and electrical engineering (152). 1 is listed as remote. The list is read daily from company career pages and public internship lists, so closed roles drop off.
Start free 1,303 open postings · updated daily
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- Application Engineer Intern, MS - Summer 2027Marvell2 LocationsSummer 2027
- Design for Test Intern, BS - Summer 2027Marvell4 LocationsSummer 2027
- Design Verification Intern, BS - Summer 2027Marvell5 LocationsSummer 2027
- Physical Design Engineer Intern, BS - Summer 2027Marvell7 LocationsSummer 2027
- Design Verification Intern, MS - Summer 2027Marvell5 LocationsSummer 2027
- Functional Validation Intern, BS - Summer 2027Marvell3 LocationsSummer 2027
- IC Validation Engineer Intern, MS - Summer 2027Marvell3 LocationsSummer 2027
- Analog Layout Intern, BS - Summer 2027Marvell2 LocationsSummer 2027
- Firmware Engineer Intern, BS - Summer 2027Marvell2 LocationsSummer 2027
- Digital IC Design Intern, BS - Summer 2027Marvell5 LocationsSummer 2027
- Aerodynamics Engineering Intern- Summer 2027The Boeing CompanyUK, United KingdomSummer 2027
- Engineering Intern - Summer 2027The Boeing CompanyUK, United KingdomSummer 2027
- Summer 2027 Internship - Mechanical Engineering - CaliforniaStryker2 LocationsSummer 2027
- Summer 2027 Internship - Manufacturing Engineering - MichiganStryker2 LocationsSummer 2027
- Summer 2027 Internship - Quality Engineering - CaliforniaStryker2 LocationsSummer 2027
- Summer 2027 Internship - Electrical Engineering - CaliforniaStryker2 LocationsSummer 2027
- Returning New Grad Field Engineer I - MAD (For current/previous HNTB interns only) – Summer 2027HNTB16 LocationsSummer 2027
- Intern Structural/Architectural Engineer - Summer 2027HNTB3 LocationsSummer 2027
- Intern Electrical Engineer - Summer 2027HNTB2 LocationsSummer 2027
- Intern Engineer - Summer 2027HNTB4 LocationsSummer 2027
- Intern Engineer - Summer 2027HNTB5 LocationsSummer 2027
- Civil Engineer Intern (Summer 2027)HNTB3 LocationsSummer 2027
- Civil Engineer Intern (Summer 2027)HNTB2 LocationsSummer 2027
- Structures Intern Engineer - Summer 2027HNTB2 LocationsSummer 2027
- Intern Engineer: Rail Operations Modeling and Planning - Summer 2027HNTB2 LocationsSummer 2027
- Civil Engineering Micro-Internship (Summer 2027)HNTB2 LocationsSummer 2027
- Geotechnical Engineering Intern (Summer 2027) – 12 or 16 Month TermStantecCalgary, AB, CASummer 2027
- Silicon Engineering InternQualcommToronto, CanadaSummer 2027
- Silicon Engineering InternQualcommToronto, ON, CASummer 2027
- Industrialization Engineer Intern (Summer 2027)LyftLongueuil, CanadaSummer 2027
- Digital IC Design InternSemtechOttawa, CanadaSummer 2027
- Firmware InternSemtechOttawa, CanadaSummer 2027
- Firmware Development Intern, PALQualcommMarkham, CanadaSummer 2027
- Firmware Development Intern - PALQualcommMarkham, ON, CASummer 2027
- Embedded Software Engineer InternAnalog DevicesToronto, CanadaSummer 2027
- Digital Design Engineer InternQualcommToronto, CanadaSummer 2027
- Digital Design Engineer InternQualcommToronto, ON, CASummer 2027
- MSIP Digital Design Verification Engineering Intern, HWQualcommToronto, CanadaSummer 2027
- MSIP Digital Design Verification Engineering Intern - HWQualcommToronto, ON, CASummer 2027
- Firmware Engineer Intern - Embedded Software Engineering - Embedded Firmware and SDK DevelopmentQualcommToronto, ON, CASummer 2027
- Firmware Engineer Intern, Embedded Software Engineering, Embedded Firmware and SDK DevelopmentQualcommToronto, CanadaSummer 2027
- Physical Mixed Layout Engineer Intern - Canada - Interim Engineering Intern - HWQualcommToronto, ON, CASummer 2027
- Physical Mixed Layout Engineer Intern, Interim Engineering HWQualcommToronto, CanadaSummer 2027
- Sensors Subsystem Engineering Intern, Multiple TeamsQualcommMarkham, CanadaSummer 2027
- Sensors Subsystem Engineering Intern - Multiple TeamsQualcommMarkham, ON, CASummer 2027
- Electronic Engineer InternMBDAStevenage, United KingdomSummer 2027
- Electronic Engineer InternTTPMelbourn, United KingdomSummer 2027
- Mechanical Engineering Intern Summer 2027Rocket Lab USAToronto, CANSummer 2027
- Client Platforms Engineer Intern - Summer 2027DV TradingLondon, United KingdomSummer 2027
- Electrical Engineering Intern Summer 2027Rocket Lab USAToronto, CANSummer 2027
Hardware internships for Summer 2027 by employer
- WSP 94
- Stantec 88
- RTX 73
- HNTB 48
- Astranis 31
- Vertiv 31
- Marvell 27
- Rocket Lab USA 27
- GlobalFoundries 26
- Qualcomm 25
- Nissan Global 21
- Blue Origin 19
- GE Vernova 18
- Stryker 18
- Applied Materials 17
- Booz Allen Hamilton 15
- ABB 14
- GE Aerospace 14
- Oshkosh 14
- Michael Baker International 13
- Parsons 13
- Charter Manufacturing 12
- Hewlett Packard Enterprise 12
- Honeywell 12
Hardware internships for Summer 2027 by field
- Engineering 1105
- Hardware engineering 168
- Electrical engineering 152
- Civil engineering 133
- Mechanical engineering 122
- Manufacturing engineering 63
- Software engineering 42
- Aerospace engineering 35
- Energy 27
- Robotics 23
- Industrial engineering 21
- Research 13
- Environment and sustainability 10
- Supply chain and logistics 10
- Construction 5
- Business 4
- Cybersecurity 3
- AI and machine learning 2
- Project management 2
- Economics 1
- Healthcare 1
- IT 1
- Journalism and writing 1
Hardware internships for Summer 2027 by city
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